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| TLP621-1/GR资料 | |
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TLP621-1/GR PDF Download |
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File Size : 116 KB
Manufacturer:TOSHIBA Description: The power dissipation of the SOTC23 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipa- tion. Power dissipation for a surface mount device is deter- mined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOTC23 package, PD can be calculated as follows: |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TLP621-1/GR 厂 家：TOSHIBA 封 装：DIP-4 批 号：03+ 数 量：1080 说 明： |
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运 费：广东省内10元(平邮),广东省外20元(快递) 所在地：深圳市 新旧程度： |
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