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| TC74ACT00F资料 | |
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TC74ACT00F PDF Download |
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File Size : 116 KB
Manufacturer:TOSHIBA Description:Note 6: If the TO-263 or TO-252 packages are used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. Using 0.5 square inches of copper area. JA is 50˚C/W; with 1 square inch of copper area, JA is 37˚C/W; and with 1.6 or more square inches of copper area, JA is 32˚C/W. If the SOT-223 package is used, the thermal resistance can be reduced by increasing the PC board copper area (see applications hints for heatsinking). |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TC74ACT00F 厂 家：TOSHIBA 封 装：SOP5.2原盘 批 号： 数 量：2052 说 明： |
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运 费：广东省内10元(平邮),广东省外20元(快递) 所在地：深圳市 新旧程度： |
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| 联系人：黄林锋 |
| 电 话：0755-82579969,83255343 |
| 手 机：13714599954, |
| QQ：172517499,137550090 |
| MSN：zfdz168@hotmail.com |
| 传 真：0755-82738881 |
| EMail：zfdz168@163.com |
| 公司地址： 深圳市福田区华强北路华强广场B座28楼L室 |
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