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| SN74LS06NSR资料 | |
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SN74LS06NSR PDF Download |
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File Size : 116 KB
Manufacturer:TI Description: The 50C/W for the D2PAK package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 2.5 Watts. There are other alternatives to achieving higher power dissipation from the surface mount packages. One is to increase the area of the Collector pad. By increasing the area of the collection pad, the power dissipation can be increased. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：SN74LS06NSR 厂 家：TI 封 装：5.2mm 批 号：01+ 数 量：1774 说 明： |
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运 费：广东省内10元(平邮),广东省外20元(快递) 所在地：深圳市 新旧程度： |
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| 联系人：黄林锋 |
| 电 话：0755-82579969,83255343 |
| 手 机：13714599954, |
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| 公司地址： 深圳市福田区华强北路华强广场B座28楼L室 |
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