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| SI3024-XS3资料 | |
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SI3024-XS3 PDF Download |
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File Size : 116 KB
Manufacturer:SIS Description:Notes a. Surface Mounted on 1 x 1 FR4 Board. b. Junction-to-foot thermal impedance represents the effective thermal impedance of all heat carrying leads in parallel and is intended for use in conjunction with the thermal impedance of the PC board pads to ambient (RthJA = RthJF + RthPCB-A). It can also be used to estimate chip temperature if power dissipation and the lead temperature of a heat carrying (drain) lead is known. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：SI3024-XS3 厂 家：SIS 封 装：3.9mm 批 号：99+ 数 量：400 说 明： |
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运 费：广东省内10元(平邮),广东省外20元(快递) 所在地：深圳市 新旧程度： |
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| 联系人：黄林锋 |
| 电 话：0755-82579969,83255343 |
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