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LMC567CN资料 | |
LMC567CN PDF Download |
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File Size : 116 KB
Manufacturer:NS Description:Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of solder profiles recom- mended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:LMC567CN 厂 家:NS 封 装:DIP-8 批 号:98+ 数 量: 说 明: |
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运 费:广东省内10元(平邮),广东省外20元(快递) 所在地:深圳市 新旧程度: |
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联系人:黄林锋 |
电 话:0755-82579969,83255343 |
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公司地址: 深圳市福田区华强北路华强广场B座28楼L室 |